| layer count |
4l | 2l | 6l | 6l | 8l | 10l | 12l | 14l | 16l |
|---|---|---|---|---|---|---|---|---|---|
| layer structure |
 |
 |
 |
 |
 |
 |
 |
 |
 |
| product type |
depth control drill |
copper base pcb |
buried copper inlaid |
1 n hdi, buries holes |
mechanical back drilling etching back drill |
2 n hdi, pofv | heavy, copper |
countersink head holes |
high layer count |
| item | manufacture capability | manufacture capability |
|---|---|---|
| layer | 2-30 layer | 2-30 layer |
| thickness | 0.3-3.5 mm | 0.2-5.0 mm |
| laminate type | fr-4、high tg | ptfe、ptfe |
| copper foil thickness | 1/3-6 oz | 1/3-14 oz |
| min.line width/space | 75 um/75 um | 50 um/60 um |
| min. through hole diameter | 0.15 mm | 0.15 mm |
| micro channel thickness ratio | 12:1 | 15:1 |
| min. blind hole diameter | 4 mil | 4 mil |
| blind aperture ratio | 0.7:1 | 1:1 |
| min. dielectric thickness | 50 um | 25 um |
| wiring layer | 2 n 2 | 3 n 3 |
| surface finish | hasl，enig，immersion tin，immersion silver，osp | |
| location | certification | certification body |
certification number |
|---|---|---|---|
| guangdong division |
iso9001 | bsi | fm523401 |
| ts16949 | bsi | ts523400 | |
| iso14001 | ksr | cnasc163e14e20050r1m | |
| ohsas18001 | wit | 15/16s0327r00 |
| location | certification | certification body |
certification number |
|---|---|---|---|
| hunan division |
iso9001 | bsi | fm575265 |
| ts16949 | bsi | ts575264 | |
| iso14001 | wit | 15/16e5201r11 | |
| ohsas18001 | wit | 15/16s5202r01 |
